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NANOTECHNOLOGY APPLICATION (S)

Cryogenic Liquid Storage Matrices:  Nanomaterials has developed a host of cryogenic liquid storage matrices which extend the hold time of cryogenic liquids up to 45%, and we continue to refine these materials with the expectation that hold time increases will exceed 100%.

 

Rapid Consolidation Nanopowders:  We are currently developing a rapid consolidation process which will allow for the production of fully dense, very large structures (>1 m2) having uniform nanostructure. 

 

Ultra High Purity Materials:  We have developed a family of sublimation-based purification processors which will are currently capable of delivering purification factors in excess of 10 million, and ultimately will deliver chemicals having impurity levels in the parts per quadrillion (ppq) range.

 

 

FEATURED NANOTECHNOLOGY APPLICATION

 

From time to time expect to see a nanomaterials application featured at this site, subject to disclosure.  An application archive URL is available to our customers.  Interested parties should write to matter@nanomaterialscompany.com.  This month we present:

 

 

ADDITIVES FOR HIGH PERFORMANCE PLASTIC PARTS

        Plasticshave widespread applications in virtually all consumer products and areexpanding into applications traditionally filled by metals, glasses andceramics. Generally, plastics including thermoset plastics and epoxies havelimited use in applications where high temperatures, high chemicalresistance, high wear resistance, high toughness and high dimensionalstability are required. The Nanomaterials Company's nanophase-plasticadditive, which is nonmetallic and non-graphitic, has extremely highchemical resistance, extremely high thermal conductivity but is anelectrical insulator. As such our nanophase plastic additive (referred tohere as“n-PA”) can be used, for example, to produce wire insulation thatallows for high heat dissipation.

Our n-PA is compounded with the plastic base material and supplied to thethermoformer as a new product. Plastic articles produced using thecompounded base material exhibit higher thermal stability, high thermalconductivity, high dimensional stability (low coefficient of thermalexpansion), high fracture toughness and high wear resistance. Due to theextremely small particle size and uniformity, our n-PA does not adverselyaffect mold flowability or influence the set point.

 

A.     Improved Performance of Plastic Part Benefits

 

Cost Reduction: Achieve higher plastic performance without need for new capital equipment, use plastics where other higher cost materials would otherwise be used, enjoy ease of fabrication of plastics in applications currently held by machined parts

 

Higher Quality:   Improved thermal conductivity, greater heat dissipation, higher impact strength, increased wear resistance, higher dimensional stability, less susceptible to corrosion

 

Industries Affected:  Automotive: light bearing, drive train, suspension, body components

Aerospace:         Complex parts in the air frame and engine, complex metal parts could be made lighter without sacrifice of strength

Locomotion:       heavy motors for trains, ships, electric cars

Industrial Equipment: valve seats, pipelining, coatings

Sporting Equipment:  cooler helmets, protective equipment

Many Others:     any manufacturing process where the advantages of high thermally conductive poorly electrically conductive plastic components are sought 

 

B.     How NanoMaterials' Plastic Additives Improve the Performance

 

B.1   Enhancement of Thermal Conductivity      

 

        Thermoset plastics are generally poor conductors of heat.  Since heat is poorly transmitted through the plastic it is absorbed by the plastic, causing its temperature to rise to that of the heat source.  n-PA has a thermal conductivity of >300 (W m-1 K-1), approaching that of silicon carbide (SiC).  The heat capacity of n-PA is ~0.7 (J g-1 K-1) and is about the same as silicon carbide.   The thermal diffusivity (i.e. the rate at which the material can respond to a temperature change) of n-PA is greater than copper but less than SiC and diamond. 

        The use of n-PA as an additive allows the plastic/nanopowder to transmit heat better and absorb heat less than the plastic alone.  n-PA will out perform aluminum oxide, also used as a plastic additive, by an order of magnitude.  Other criteria not discussed here indicates that n-PA is the material of choice even in cases where diamond or silicon carbide might be desired from a heat transfer perspective.    

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Please contact us at  matter@nanomaterialscompany.com to explore your nanomaterials product application or processor needs.

 

 

 

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